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Model 865 Flip Chip Bonder

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Model 865 Flip Chip Bonder

Overview

The Model 865 Flip Chip die bonder is ideal for R & D and low volume production. Applications include solder and gold bumped flip chip, AuSn eutectic, thermosonic, thermocompression and epoxy die bonding. Some of the process capabilities that support these applications are ultrasonic scrub, linear mechanical scrub, compression bonding, flux dipping and hot gas spot heating.  The system is designed for maximum versatility and ease of operation.

 

 

Features

Head Designs

  • Precision servo-driven Zmotion with bond load ranges of 10 grams to 10 kilograms controlled by closed loop system. Head die tools include flat face or collet design for specific applications. Head options include:  
    • Single Tool Head with bond loads to 10 KG and heating to 300 degrees C. Linear Scrub is an option.
    • Dual Tool Head with pivoting die tool and preform tool with bond loads to 2 KG and heating to 250 degrees C. Allows preform and die placement in one cycle without tool switch-over. Pin transfer tool can also be used for adhesive. Linear Scrub is an option.
    • Ultrasonic Head with loads to 3 KG.
    • Pulsed Thermal Bond Head with loads to 10 KG and ramping of 100 degrees C per second to maximum of 450 degrees C.

Workstage Designs

  • Micrometer adjusted workstage for alignment in X, Y and theta. Workchucks have vacuum hold-down or mechanical clamps. Custom workchucks available.
  • ¾” Rapid Heat Cycle Workstage with quick heat up ramping to 450 degrees C and heated cover gas manifold with separate temperature control. Cooling gas manifold optional.
  • 2” x 2” Heated Workstage with maximum temperature of 450 degrees C and heated cover gas manifold.
  • 4” x 4” Heated Workstage with maximum temperature to 350 degrees C.
  • 4” x 4” Unheated Workstage with aluminum workchuck.

 Viewing System  

  • Retractable cube beam splitter vision system features a 12x zoom lens, digital camera, image capture, LED array lighting, electronic crosshair and a 17” LCD display.
  • Direct View System option consists of stereo zoom microscope with 10X eyepieces, pivot mounting and ring light illumination. Allows operator to observe bonding process.
  • Motorized Viewer option provides 5/8” travel from center in X and Y to facilitate alignment of large devices at high magnification.

 Computer Control  

  • Windows-based computer with a 21” 4K monitor

Options

For Flip Chip applications:

  • Thermocompression bond head with temperatures up to 250 degrees C operation.
  • Heated stage with closed loop temperature controls, operation up to 350 degrees C.
  • Dual nozzle hot gas spot heating system for localized heating.
  • Choice of motorized tray or manual tray and doctor blade for flux or adhesive dipping.

For bonding edge emitting Laser Diodes:

  • Rapid heat-up stage.
  • Dual tool bond head consisting of one heated die tool and one preform tool.
  • Servo-controlled ultra fine linear scrub bond head with voice coil and preform tool for < 250 degrees C operation; extremely repeatable operation returning to starting point within plus or minus 5 microns.
  • Direct viewing stereo zoom microscope with 10X eyepieces on pivoting mount with fiber optic illuminators.
  • Single nozzle hot gas heating system for localized heating.

Eutectic die bonding:

  • Heated stage with closed loop temperature controls, operation up to 350 degrees C.
  • Dual tool bond head consisting of one heated die tool and one preform tool.
  • Dual nozzle hot gas spot heating system for localized heating.
  • Servo-controlled ultra fine linear scrub bond head with voice coil and preform tool for < 250 degrees C operation; extremely repeatable operation returning to starting point within plus or minus 5 microns.

Specifications

  • 0.5 Micron placement accuracy using alignment plates at 120 degrees C. (Actual die placement accuracy depends on the application).
  • Die sizes up to 2.0" sq.
  • Magnification up to 560X.
  • Viewable area 2.0" square. (with optional X-Y motorized viewer)
  • 2"X2" or 4"X4" waffle pack pick-up stage.
  • Stages 1", 2", 4" square standard. (other sizes and shapes available)
  • Stage temperatures to 450 degrees C (depends on stage selected)
  • Temperature ramp rate for 2" stage (most common) is 20 degrees C per second.
  • Bond load ranges from 10 grams to 10 kilograms. (depends on bond head selected)
  • Bond head temp to 400 degrees C. (depends on bond head selected)
  • Throughput - up to 200 placements per hour.
  • Compressed Air: 60 psi
  • Vacuum: 20" Hg
  • Cover Gas: 40 psi
  • Power: 120V, 10 amp - 50-60 Hz / 220V, 5 amp - 50-60 Hz
  • Size: 44 " W x 38 " D x 72 " H
  • Weight: 300 lbs.
  • Shipping Weight: 400 lbs.

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