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What's New

27 June 2017

New Model 365 UV Curing System

Posted in What's New

by Don Moore - SEC President

New Model 365 UV Curing System

Introducing the Model 365 UV Curing System for Dicing and Back Grinding Tape

SEC will display the new Model 365 UV Curing system this year at Semicon West 2017 in San Francisco. The Model 365 features the same long light source life and simple operation as our popular Model 360. New features include much higher watt density (70 mW/cm2), most dicing tapes cured in about 5 seconds, touch screen display, self diagnostics detect LED failure. Larger cure area will expose adhesive on 300 mm frames for easy cleaning.

Standard features of the Model 365

10,000 hour LED life

Instant on, no warm-up

70mW/cm2watt density @ 365nM

Nitrogen purge capability

Touch screen display

Self diagnostics

Modular LED board design

No external ventilation needed

Works with all wafers & film frames up to 300 mm

27 June 2017

Semicon West - Live Demos!

Posted in What's New

by Don Moore - SEC President

SEC will do live demonstrations of Wafer Mounting, UV Tape, UV cure, and Die Picking in our booth 5958 at Semicon West 2017.

 

SEC will have a Model 3150 Wafer/Frame Tape Applicator loaded with Nitto DU300 UV Dicing Tape. We will mount a 200 mm wafer on a frame. We will not have dicing capability so we will cure the full wafer undiced on the New Model 365 UV Exposure System. Next we will remove the wafer from the tape on a Model 4800 Die Ejector Grid demonstrating the removal of die from tape without a pin poker.

28 April 2014

Cleaning Wafer - New Product

Posted in What's New

Cleaning Wafer - New Product

The Nitto Cleaning Wafer removes particles from electrostatic and vacuum wafer chucks without a costly shutdown of the Fab tool. A patented coating attaches particles to the wafer and removes them from the tool. Captured particles can be examined to assist with preventative measures. The Cleaning Wafer can also prevent particles from accumulating with regular use.

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28 April 2014

FOUP Cleaner

Posted in What's New

FOUP Cleaner

Semiconductor Equipment Corporation's SORA UPC-12500 Fully Automatic FOUP Cleaning System has the highest throughput among single FOUP processing systems.

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28 April 2014

MSA840-II Nitto Denko

Posted in What's New

MSA840-II Nitto Denko

Semiconductor Equipment Corporation is the distributor for the new Nitto Denko MSA840-II Semiautomatic Wafer Mounter. The operator simply places the wafer and frame. The system automatically feeds the tape, applies it to the frame and wafer, trims the tape and removes the waste. 

The MSA840-II can be converted to full automatic operation with the addition of a wafer and frame handling tool.

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28 April 2014

New In-process Planarity Option has added to the Model 860 Eagle Bonder

Posted in What's New

Some bonding applications require the ability to adjust the die to substrate planarity during each die bonding cycle. Laser bars and focal plane arrays are two examples. See the new paper in the “Application Notes” section of this site for details.

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28 April 2014

Tape Peeler Option

Posted in What's New

Model 1810 Die Matrix Expander

Peeler for removing backgrinding tape once the wafer has been thinned. This option includes a roller assembly, vacuum chuck and tape dispenser. The peeler can be added to any 3200 or 3250.

Check out the options section of the Model 3200/3250 for more information.

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