Heat Release Tape
Heat Release Tape is a unique thermal release tape that behaves like normal adhesive tape at room temperature but can be easily peeled off by simply heating when you want to remove the tape.
There is a Semiconductor Equipment Tape that is Perfect for Your Application.
Semiconductor Equipment Corporation's Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear strength and elongation. It is used extensively for Wafer Sawing, Scribing, Expanding. These tapes are available in rolls suitable for all automatic and manual wafer mounting systems where the wafers are being mounted onto tape and film frames.
Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker dicing tape.
Please contact our Tape Specialist for additional information at (805) 529-2293.