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Model 3200 Wafer/Backlap Applicator

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Model 3200 Wafer/Backlap Applicator

Overview

Semiconductor Equipment Corporation´s Model 3200 and 3250 apply Protective Tape to Your Wafer Prior to Backlapping. The applicator also:

  • Eliminates bubbles between tape and wafer
  • Provides uniform tension between tape and wafer
  • Operates with backed and non-backed tape
  • Provides adjustable roller pressure
  • Cuts tape within .005 " of edge of wafer

Features

Model 3200

  • Up to 6" wafer capability standard.
  • Trims tape to the edge of the wafer including the flats, within .005".
  • Manual tape feed.
  • Manual tape tensioner.
  • Compatible with standard or interleaved tape.
  • Vacuum stage wafer hold-down.
  • Built in cutter tape separation systems.
  • Captive roller assembly assures consistent wafer/film frame contact pressure.
  • Adjustable spring loaded platen for optimum contact pressure.
  • Manual.

Model 3250

  • Four, five, six and eight inch wafer capability standard.
  • Trims tape to the edge of the wafer including the flats, within .005 ".
  • Manual tape feed.
  • Manual tape tensioner.
  • Compatible with standard or interleaved tape.
  • Vacuum stage wafer hold-down.
  • Built in cutter tape separation systems.
  • Captive roller assembly assures consistent wafer/film frame contact pressure.
  • Adjustable spring loaded platen for optimum contact pressure.
  • Manual.

Options

  • Static Eliminator with power supply.
  • Heated Blade Assembly. Heats cutting blade to reduce friction when cutting particular types of back lapping tapes. Heats to 75 degrees C.
  • Motorized Take-up System to gather the liner from dicing tape onto a disposable core. Many semiconductor dicing tapes have a protective liner, which has to be gathered and disposed of. This option makes that process effortless and convenient.
  • DeTaper Option: for removing backgrinding tape once the wafer has been thinned. Includes: a) Roller assembly carrier. b) Vacuum chuck c) Tape dispenser

Specifications

  • Weight: 25 lbs.
  • Height: 8"
  • Width: 14"
  • Length: 24"
  • Vacuum: 25" H20

Other Info

Spare Parts

  • Spare Blades, End Cut, P/N 19190
  • Spare Blades, Rotary, Wafer Trimme

Step by Step Procedure

Quickly, Easily and Uniformly Mounts Protective Tape to Wafer for Back Lap Operation

Step 1 Step #1
Grasp tape from storage position. Pull over wafer mounting platen.
Step 2 Step #2
Affix tape to tensioner frame.
Step 3 Step #3
Roll tape with preset tension across wafer for bubble-free application.
Step 4 Step #4
Close cutter cover.
Step 5 Step #5
Separate tape from roll, using built-in slitter.
Step 6 Step #6
Using built-in fail-safe circular cutter, rotate handle in either direction to trim tape away from tension frame.
Step 7 Step #7
Remove finished wafer assembly.

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