DescriptionThe UA8400 irradiates UV light to dicing tape on the wafer back side to reduce the adhesion strength which allows for handling after the dicing process.
Features8"/6" frame available
UV irradiation time automatically calculation
Irradiation area expand (To Frame area)
Check mark stamp after UV irradiation
Easy operation by Touch panel & Recipe function
Log file function standard equipment
Follow to CE mark / SEMI S2/S8