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UA8400 Auto UV Irradiator / 200mm wafers

UA8400 Auto UV Irradiator / 200mm wafers

Description

The UA8400 irradiates UV light to dicing tape on the wafer back side to reduce the adhesion strength which allows for handling after the dicing process.

Features

8"/6" frame available UV irradiation time automatically calculation Irradiation area expand (To Frame area) N2 purge Check mark stamp after UV irradiation Easy operation by Touch panel & Recipe function Log file function standard equipment Follow to CE mark / SEMI S2/S8

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