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HSA840-ii Semi-auto Tape Remover / 200mm wafers

HSA840-ii Semi-auto Tape Remover / 200mm wafers

Description

The HSA 840-ll removes protection tape from the wafer patterned surface after the back-grinding process.

Features

8"/6""/5"/4" wafer available 8"- 4" wafer handling available by 1 table Easy operation by Touch panel Follow to CE mark / SEMI S2/S8"

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