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HR8500-III Full-auto Tape Remover / 200mm wafers

HR8500-III Full-auto Tape Remover / 200mm wafers

Description

The HR8500-III removes protection tape from the wafer patterned surface after back-grinding.

Features

8"/6"/5""wafer available - 4" wafer handling (Option) Table heating function Thin wafer available (TW version) Easy operation by Touch panel Adding SECS/GEM available

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