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DSA840-II Semi-auto Protection Tape Applicator / 200mm wafers

DSA840-II Semi-auto Protection Tape Applicator / 200mm wafers

Description

The DSA 840-ll applies protection tape on the wafer patterned surface for the back-grinding process.

Features

8"/6"/5"/4" wafer available 8"- 4" wafer handling available by 1 table Easy operation by Touch panel Follow to CE mark / SEMI S2/S8

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