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DR8500-III Automatic Protection Tape Applicator / 200mm wafers

DR8500-III Automatic Protection Tape Applicator / 200mm wafers

Overview

The DR8500-III applies protection tape on the wafer patterned surface for the back-grinding process.

Features

8"/6"/5" wafer available 4" wafer handling function (Option) Low tension applying (RF version) Adding Table/ Roller heating function available Easy operation by Touch panel Follow to CE mark Adding SECS/GEM available

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