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Model 860 Eagle Omni Bonder

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Model 860 Eagle Omni Bonder

Overview

Semiconductor Equipment Corporation's New Model 860 Eagle is a multi-use semiautomatic system ideal for R & D and low volume production.  Applications include solder and gold bumped flip chip, eutectic bonding including laser diodes and bars and epoxy bonding. Some of the process capabilities that support these applications are ultrasonic, thermosonic, scrub, flux dipping and hot gas spot heating. The new system is designed for maximum versatility and ease of operation.

The Eagle's base platform includes a retractable cube beam splitter viewing system with LED lighting, precision servo-driven Z motion with closed loop bond load control, closed loop temperature controls for head, stage and spot heating and Windows XP Pro operating system.  Various standard heads and stages are available.

Features

Head Designs

  • Precision servo-driven Z motion with bond load ranges of 10 grams to 10 kilograms controlled by closed loop system. Head die tools include flat face or collet design for specific applications. Head options include:  
    • Single Tool Head with bond loads to 10 KG and heating to 300 degrees C. Linear Scrub is an option.
    • Dual Tool Head with pivoting die tool and preform tool with bond loads to 2 KG and heating to 250 degrees C. Allows preform and die placement in one cycle without tool switch-over. Pin transfer tool can also be used for adhesive. Linear Scrub is an option.
    • Ultrasonic Head with loads to 3 KG.
    • Pulsed Thermal Bond Head with loads to 10 KG and ramping of 100 degrees C per second to maximum of 450 degrees C.

Workstage Designs

  • Micrometer adjusted workstage for alignment in X, Y and theta. Workchucks have vacuum hold-down or mechanical clamps. Custom workchucks available.
  • ¾” Rapid Heat Cycle Workstage with quick heat up ramping to 450 degrees C and heated cover gas manifold with separate temperature control. Cooling gas manifold optional.
  • 2” x 2” Heated Workstage with maximum temperature of 450 degrees C and heated cover gas manifold.
  • 4” x 4” Heated Workstage with maximum temperature to 350 degrees C.
  • 4” x 4” Unheated Workstage with aluminum workchuck.

 Viewing System  

  • Retractable cube beam splitter vision system features a 12x zoom lens, digital camera, image capture, LED array lighting, electronic crosshair and a 17” LCD display.
  • Direct View System option consists of stereo zoom microscope with 10X eyepieces, pivot mounting and ring light illumination. Allows operator to observe bonding process.
  • Motorized Viewer option provides 5/8” travel from center in X and Y to facilitate alignment of large devices at high magnification.

 Computer Control  

  • Computer with Windows XP operating system, CD drive, floppy drive, keyboard, mouse and 17” LCD display. Improved machine control software uses macros to set-up and save machine processes.

Options

For Flip Chip applications:

  • Thermocompression bond head with temperatures up to 250 degrees C operation.
  • Heated stage with closed loop temperature controls, operation up to 350 degrees C.
  • Dual nozzle hot gas spot heating system for localized heating.
  • Choice of motorized tray or manual tray and doctor blade for flux or adhesive dipping.

For bonding edge emitting Laser Diodes:

  • Rapid heat-up stage.
  • Dual tool bond head consisting of one heated die tool and one preform tool.
  • Servo-controlled ultra fine linear scrub bond head with voice coil and preform tool for < 250 degrees C operation; extremely repeatable operation returning to starting point within plus or minus 5 microns.
  • Direct viewing stereo zoom microscope with 10X eyepieces on pivoting mount with fiber optic illuminators.
  • Single nozzle hot gas heating system for localized heating.

Eutectic die bonding:

  • Heated stage with closed loop temperature controls, operation up to 350 degrees C.
  • Dual tool bond head consisting of one heated die tool and one preform tool.
  • Dual nozzle hot gas spot heating system for localized heating.
  • Servo-controlled ultra fine linear scrub bond head with voice coil and preform tool for < 250 degrees C operation; extremely repeatable operation returning to starting point within plus or minus 5 microns.

Specifications

  •  +/- 5 um depending on application
  • Die sizes from 0.006" square to 1.00"
  • Four 2"X2" or 4"X4" waffle pack pick-up stage.
  • Workstage options include 4"X4" cold stage, 4"X4" heated stage or 3/4" rapid heat-up stage.
  • Bond load ranges from 5 grams to 10 kilograms.
  • Throughput - up to 200 placements per hour.
  • Compressed Air: 60 psi
  • Vacuum: 20" Hg
  • Cover Gas: 40 psi
  • Power: 115V, 10 amp - 50-60 Hz / 220V, 15 amp - 50-60 Hz
  • Size: 40 " W x 36 " D x 36 " H
  • Weight: 500 lbs.
  • Shipping Weight: 600 lbs.

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