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	Cleaning FOUPs and FOSBs is required to improve and maintain the yeild of the semiconductor munufactring process. The HNM-300 can wash and dry a variety of FOUPs and FOSBs in one system without changing the set-up because of our unique chamber structure.

High through-put (compared with our previous system) Small foot print design Protection from electrostatic charge Super purity washing by nozzle jet Hot air knife drying method will shorten drying time efficiently Automatic FOUP Opener function (option) Complete Drying by reliable and successful “hot air spraying” and “high speed spin” Dust suppression, ESD elimination system equipping with fine filter and Ionizer Securing working space for disassemble & assemble container (no need to arrange clean booth separately) Automatic purging function to prevent growth of bacteria Auto flushing fuction prevents dead water Easy operation by touch panel Ensure High safety with completion of various interlocking system

	Dimension: 2300(W)x1400(D)x2200(H)mm （Excluding any projections） Weight: 800kg Power: 3 phase AC200+-10V Exhaust: 3000 litter/min Drain: 10 litter/min D.I .Water: Supply (10 litter/min as minimum) Pressure (0.3Mpa) CDA (Clean Dry Air) Supply (2500 litter/min) Pressure (0.75Mpa) Automatic FOUP opener and filter for DI water are available as optional item

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