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HNM-300 FOUP/FOSB Cleaning System
  Products Overview CRD 4300

Cleaning FOUPs and FOSBs is required to improve and maintain the yeild of the semiconductor munufactring process. The HNM-300 can wash and dry a variety of FOUPs and FOSBs in one system without changing the set-up because of our unique chamber structure.

 
  Product Features
  • High through-put (compared with our previous system)
  • Small foot print design
  • Protection from electrostatic charge
  • Super purity washing by nozzle jet
  • Hot air knife drying method will shorten drying time efficiently
  • Automatic FOUP Opener function (option)
  • Complete Drying by reliable and successful “hot air spraying” and “high speed spin”
  • Dust suppression, ESD elimination system equipping with fine filter and Ionizer
  • Securing working space for disassemble & assemble container (no need to arrange clean booth separately)
  • Automatic purging function to prevent growth of bacteria
  • Auto flushing fuction prevents dead water
  • Easy operation by touch panel
  • Ensure High safety with completion of various interlocking system

  Product Specifications
  • Dimension: 2300(W)x1400(D)x2200(H)mm (Excluding any projections)
  • Weight: 800kg
  • Power: 3 phase AC200+-10V
  • Exhaust: 3000 litter/min
  • Drain: 10 litter/min

  • D.I .Water:
  • Supply (10 litter/min as minimum)
  • Pressure (0.3Mpa)

  • CDA (Clean Dry Air)
  • Supply (2500 litter/min)
  • Pressure (0.75Mpa)

  • Automatic FOUP opener and filter for DI water are available as optional item


Contact Sales for more product information.
Semiconductor icons   Semiconductor Equipment Corporation
5154 Goldman Ave.
Moorpark, CA 93021
Phone: (805) 529-2293
Fax: (805) 529-2193
sales@semicorp.com
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