"Forty Years of Innovation."

Published Articles

26 March 2014

Automation in Die Bonding: When Less is Better

Posted in Published Articles

by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Meptec Report, January/February 2000

26 March 2014

BGA Rework Technology

Posted in Published Articles

by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
N/A

04 March 2010

Bonder Design Meets Telecom Challenges

Posted in Published Articles

by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Laser Focus World, May 2001

26 March 2014

Die Bonding in an Optoelectric World

Posted in Published Articles

by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Circuits Assembly, 2001

26 March 2014

Diode Bonding Evolves to Meet Telecom Demand

Posted in Published Articles

by Edward Stephens, Industrial Microphotonics Co.
St. Charles, MO
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Optoelectronics World, 1999

26 March 2014

Flip Chip Attachment

Posted in Published Articles

by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
N/A

26 March 2014

Flip Chip on Flex Interconnect Guidelines

Posted in Published Articles

by Tim Patterson, Smartflex Systems, Iinc.
Tustin, CA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Circuit Assembly, November 1999

26 March 2014

Gearing up for Flip Chip

Posted in Published Articles

by George Riley, HyComp Inc.
Marlborough, MA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Solid State Technology, 1999

26 March 2014

Reworking Underfilled Flip Chips

Posted in Published Articles

by Don Moore, President, Semiconductor Equipment Corporation
by Gloria Studley, Design Engineer, Semiconductor Equipment Corp.
Moorpark, CA
US Tech, July/August 2000

26 March 2014

Sticky Issues with Semiconductor Processing Tape

Posted in Published Articles

by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Semiconductor International, 1996

09 March 2010

Versatile Bonder is the Design Key to Attaching Laser Diodes

Posted in Published Articles

by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
US Tech, July 2001