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Application Notes

26 March 2014

Inexpensive In-process Planarity Adjustment for Die Attach

Posted in Application Notes

Equipment: Model 860 Eagle Bonder

 

Application: Inexpensive In-process Planarity Adjustment for Die Attach
Equipment: Model 860 Eagle Bonder

 

26 March 2014

Rework of Underfilled Flip Chips

Posted in Application Notes

Equipment: Model 850 Flip Chip Placement System with Model 870 Rework Option

 

Application: Rework of underfilled flip chips
Equipment: Model 850 Flip Chip Placement System with Model 870 Rework Option

 

26 March 2014

Hot Gas Rework

Posted in Application Notes

Equipment: Model 4450 Hot Gas Rework Station

 

Application: Hot Gas Rework
Equipment: Model 4450 Hot Gas Rework Station

 

26 March 2014

Picking Die From Tape

Posted in Application Notes

Equipment: Model 4750 Die Ejector System; Model 4800 Die Ejector Grid System; Model 830 Pick & Place System

 

Application: Picking die from dicing tape
Equipment: Model 4750 Die Ejector System; Model 4800 Die Ejector Grid System; Model 830 Pick and Place System

 

26 March 2014

Solder Flip Chip

Posted in Application Notes

Equipment: Model 850 Flip Chip Placement System

 

Application: Solder Flip Chip
Equipment: Model 850 Flip Chip Placement System

 

26 March 2014

Bonding VCSEL's

Posted in Application Notes

Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder

 

Application: Bonding vertical-cavity surface-emitting lasers (VCSELS) using gold/tin preforms
Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder

 

26 March 2014

Wafer Mounting for Dicing

Posted in Application Notes

Equipment: Model 300, 3100 and 3150 Wafer Film Frame Tape Applicators

 

Application: Wafer mounting for dicing
Equipment: Models 300, 3100 & 3150 Wafer Film Frame Tape Applicators

 

26 March 2014

Bonding Edge Emitting Laser Diodes

Posted in Application Notes

Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder

 

Application: Bonding edge emitting laser diodes using gold/tin preforms
Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder

 

26 March 2014

Thermosonic Bonding Gold Bumped Die

Posted in Application Notes

Equipment: Model 410 Flip Chip Aligner/Bonder; Model 410XP Precision Bonder; Model 860 Omni Bonder

 

Application: Thermosonic bonding gold bumped die.
Equipment: Model 410 Flip Chip Aligner/Bonder, Model 410XP Precision Bonder, Model 860 Omni Bonder.