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Published Articles
  Article Index
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  Versatile Bonder is the Design Key to Attaching Laser Diodes
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
US Tech, July 2001

 

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  Bonder Design Meets Telecom Challenges
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Laser Focus World, May 2001

 

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  Reworking Underfilled Flip Chips
by Don Moore, President, Semiconductor Equipment Corporation
by Gloria Studley, Design Engineer, Semiconductor Equipment Corp.
Moorpark, CA
US Tech, July/August 2000

 

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  Automation in Die Bonding: When Less is Better
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Meptec Report, January/February 2000

 

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  Flip Chip on Flex Interconnect Guidelines
by Tim Patterson, Smartflex Systems, Iinc.
Tustin, CA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Circuit Assembly, November 1999

 

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  Diode Bonding Evolves to Meet Telecom Demand
by Edward Stephens, Industrial Microphotonics Co.
St. Charles, MO
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Optoelectronics World, 1999

 

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  Gearing up for Flip Chip
by George Riley, HyComp Inc.
Marlborough, MA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Solid State Technology, 1999

 

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  Sticky Issues with Semiconductor Processing Tape
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Semiconductor International, 1996

 

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  Die Bonding in an Optoelectric World
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Circuits Assembly, 2001

 

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  Flip Chip Attachment
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
N/A

 

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  BGA Rework Technology
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
N/A

 

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5154 Goldman Ave.
Moorpark, CA 93021
Phone: (805) 529-2293
Fax: (805) 529-2193
sales@semicorp.com
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