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Application Notes
  Application Index
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  Inexpensive In-process Planarity Adjustment for Die Attach
Equipment: Model 860 Eagle Bonder

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  Rework of Underfilled Flip Chips
Equipment: Model 850 Flip Chip Placement System with Model 870 Rework Option

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  Hot Gas Rework
Equipment: Model 4450 Hot Gas Rework Station
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  Picking Die From Tape
Equipment: Model 4750 Die Ejector System; Model 4800 Die Ejector Grid System; Model 830 Pick & Place System
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  Solder Flip Chip
Equipment: Model 850 Flip Chip Placement System
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  Bonding VCSEL's
Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder
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  Wafer Mounting for Dicing
Equipment: Model 300, 3100 and 3150 Wafer Film Frame Tape Applicators
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  Bonding Edge Emitting Laser Diodes
Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder
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  Thermosonic Bonding Gold Bumped Die
Equipment: Model 410 Flip Chip Aligner/Bonder; Model 410XP Precision Bonder; Model 860 Omni Bonder
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Semiconductor icons   Semiconductor Equipment Corporation
5154 Goldman Ave.
Moorpark, CA 93021
Phone: (805) 529-2293
Fax: (805) 529-2193
sales@semicorp.com
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